特点 features
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低压损 Low pressure drop
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高效率 High efficiency
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重量轻 light weight
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厚度薄 Thin in depth
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运行成本低 Low operation cost
用途 uses
超LSI制造工场、半导体制造工场、原子力研究中心、无尘室、层流设备、工作台等其它要求超高洁净度的场合。
Manufacturing lines for ULSI, manufacturing plants for semiconductors of 16M and above、cleanrooms、clean bench、clean booth, ect..
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